PCB Manufacturing & Assembly Capabilities
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PCB Specifications
Features | Capability | Notes | Patterns |
|---|
Layer count | 1-20 Layers | The number of the copper layer of the boards. |  |
Material | FR-4 Aluminum Copper core Rogers Ceramic | FR-4 PCB: Tg 130 / Tg 150 / Tg 170 Aluminum PCB: 1- 3 W/(m*k) Copper core: 380 W/(m*k) Rogers: RO4350B / RO4003C Ceramic: Al2O3 / AIN |  |
Board Dimension | FR-4 PCB: 5mm*5mm (Min), 600mm*600mm (Max) Aluminum PCB: 5mm*5mm (Min), 600mm*600mm (Max) Copper core: 5mm*5mm (Min), 600mm*600mm (Max) Rogers: 5mm*5mm (Min), 500mm*500mm (Max) Ceramic: 5mm*5mm (Min), 100mm*100mm (Max) | The size of the PCB board |  |
Dimension Tolerance | ±0.15mm | ±0.15mm(Regular) for CNC routing, and ±0.4mm for V-scoring | |
Board Thickness | 0.4-5.0mm | The finished thickness of the board |  |
Thickness Tolerance | ± 0.1mm or ± 10% | ± 0.1mm for board thickness ≤1.6mm, ± 10% for board thickness ≥1.6mm | |
Finished Copper | 0.5oz - 3oz | Outer Layer: 1oz / 2oz / 3oz Inner Layer: 0.5oz / 1oz / 2oz |  |
Surface Finish | HASL (with lead/ lead-free), ENIG, OSP, ENEPIG | The extra process to exposed copper to help solderability. |
Drill/Hole Size
Minimum Annular Ring
Minimum clearance
Minimum trace width and spacing
BGA
Solder Mask
